Manufacturing Facility - Shenzhen

Total Floor Area: 32,000 Sq m
Total Building area: 40,300 Sq m
Equipment

5 x Fuji(NXT) SMT Lines with AOI

5 x Yamaha SMT Lines
8 x Automatic Wave Soldering Machines
2 x X-Ray Machines for BGA bonding inspection
3 x Wire Bonding Machines
9 x Auto-Insertion Machines

Temperature Cycle and Humidity Chamber

Various Reliability Test Machines including Drop Test, Vibration Test, Pull Test, Keyboard Life Test

Plastic injection Machines
     Clamping Force 200 Tons x 3 machines
     Clamping Force 160 Tons x 2 machines
     Clamping Force 120 Tons x 2 machines

 

 

 

CMM Measuring Machines
X-Ray Fluorescence Spectrometer for inspection of RoHS component compliance
BGA Rework Station

Special equipment for manufacturing/testing of satellite TV receivers

Anti-Static Substore

SMT       0201 chip       BGA 0.4mm ball to ball
Wire Bond 80um pad pitch
Through Hole wave soldering
ICT / ATE Machines
Self-developed Jig and Fixture
Burn-in Test
Bar Code Traceability System
Insert Molding capability

 

Manufacturing Facility - Taishan