Company Profile
Manufacturing Facilities
Manufacturing Facility - Shenzhen

Location      Fuyong, Shenzhen, China

Production Facility

Total Floor Area: 32,000 Sq m
Total Building area: 40,300 Sq m

5 x Fuji(NXT) SMT Lines with AOI

5 x Yamaha SMT Lines
8 x Automatic Wave Soldering Machines
2 x X-Ray Machines for BGA bonding inspection
3 x Wire Bonding Machines
9 x Auto-Insertion Machines

DSC5612 DSC6785ex

Temperature Cycle and Humidity Chamber

Various Reliability Test Machines including Drop Test, Vibration Test, Pull Test, Keyboard Life Test

DSC6482Plastic injection Machines
     Clamping Force 200 Tons x 3 machines
     Clamping Force 160 Tons x 2 machines
     Clamping Force 120 Tons x 2 machines




CMM Measuring Machines
X-Ray Fluorescence Spectrometer for inspection of RoHS component compliance
BGA Rework Station


Special equipment for manufacturing/testing of satellite TV receivers


Anti-Static Substore


Manufacturing Capability

SMT       0201 chip       BGA 0.4mm ball to ball
Wire Bond 80um pad pitch
Through Hole wave soldering
ICT / ATE Machines
Self-developed Jig and Fixture
Burn-in Test
Bar Code Traceability System
Insert Molding capability




Manufacturing Facility - Taishan

Location     Approximately 200km from our Shenzhen Factory

Area           133,000 Sq m

Production Floor Area
      Phase I: 43,000 Sq m (completion is due early 2015)
      Phase II: 43,000 Sq m
      Phase III: 43,000 Sq m

Factory Outlook

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